| Technology |
3DV Systems' image sensing technology generates distance (depth) information for each pixel or object captured by the camera, as well as color video. The technology is based on the Time-Of-Flight (TOF) principle. The Depth information is captured by emitting pulses of infra-red light to all objects in the scene and sensing the reflected light from the surface of each object. All objects in the scene are then arranged in layers according to the distance information sensed by the D pixels in the camera, providing the Depth information in real time as standard black and white video where the grey-level correlates to relative distance. Color data is provided using a normal color imaging sensor. The company has filed for 22 patents related to its technology, 7 of which were granted to date.
Fig.1 - moving light wall Fig.2 - reflected light
Fig. 3 - gating reflected light Fig. 4 - RGB and depth image
3DV's core technologies are in the 3D system level, in nano-second imaging-quality shutters based on GaAs or Silicon, as well as in extremely fast and tightly controlled illumination. The technology performs superior depth imaging (depth resolution of millimeters) in real-time (60 fps or more), using little or no CPU.
Publications:
"Depth Key"
Ronen Gvili, Amir Kaplan, Dr. Eyal Ofek and Dr. Giora Yahav
SPIE Electronic Imaging 2003 Conference
Santa Clara, California
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"3D Imaging in the studio"
Dr. G. J. Iddan & Dr. G. Yahav
SPIE Vol. 4298, pp. 48.
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"3D imaging Camera for Gaming Application"
G. Yahav, G.J. Iddan & D. Mandelbaum
Submitted to IEEE 2006
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“Towards and optimized 3D broadcast chain”
Marc Op de Beeck, Piotr Wilinski, Christophe Fehn, Peter Kauff, Wijnand Ijsselsteijn, Marc Pollefeys, Luc Van Gool, Eyal Ofek and Ian Sexton
SPIE vol. 4864, pp. 42
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